multilayer PCB
英 [ˌmʌltɪˈleɪə ˌpiː siː ˈbiː]
美 [ˌmʌltiˈleɪər ˌpiː siː ˈbiː]
网络 多层电路板; 多层线路板; 多层板; 多层印制电路板
双语例句
- Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment, lead-free PCB process etc.
适合于多层PCB、计算机及外围设备、通讯设备、办公自动设备、PCB无铅制程等。 - New technologies, Process, and Raw Materials development of Multilayer PCB Manufacturing ( R& D Department).
多层精密线路板（PCB）生产新工艺，技术，原材料和设备开发。 - Specialize manufactured double sided and multilayer PCB from 1986.
简介：成立于1986年，是生产双面和多层印制板的专业公司。 - Embedded Filters based on Multilayer PCB design
基于多层PCB板的嵌入式滤波器设计 - This article discussed the manufacturing technology of multilayer PCB with buried and blind hole, also explained the key process control in detail.
本文阐述了埋盲孔多层印制板的制作工艺，并对关键工序的控制作了详细说明。 - This paper describes the outline and the method of the thickness control for heavy copper multilayer PCB with blind and buffed vias.
简要概述了带有埋/盲孔厚铜箔多层印制板制作过程中的厚度控制要点和方法。 - Manufacturing Technology of Multilayer PCB with Buried/ Blind Via
埋/盲孔多层PCB制作工艺 - This article introduced application of laser drill in manufacturing of HDI multilayer blind via PCB.
本文主要介绍了激光钻孔技术在HDI多层盲孔板制造技术方面的应用。 - Quality Control Of The Project Datum Of The Multilayer PCB
多层印制板工程资料的质量控制 - Design of multilayer PCB and way of increasing reliability
多层印制板设计与提高可靠性的途径 - The Thickness Control of Heavy Copper Multilayer PCB with Blind and Buried Vias
浅谈多层埋/盲孔厚铜板的厚度控制 - Multilayer Lamination Methods for PTFE-based PCBs
基于PTFE的PCB的多层层压方法 - The Process Technology of the Microwave Multilayer PCB
微波多层板工艺技术 - The Desmear Technology of Thick Multilayer PCB
PCB多层厚板的去钻污工艺 - The Application of Laser Drill in Multilayer PCB of Blind Via
激光钻孔在盲孔多层板的应用 - The Manufacture Process Discussion on Engraved Metal Blend Material MW Multilayer PCB
镂空金属基混合多层微波板制造工艺探讨 - For the model of the electromagnetic interference from a signal line and a shielding line placed nearby the signal line to adjacent layer, a modified algorithm of computing radiation for a shielding line on multilayer PCB geometry is proposed.
针对置有单屏蔽带多层PCB强信号线对邻层电磁干扰的模型，提出了一种修正的单屏蔽带多层微带PCB结构的电磁辐射计算方法。 - Based on the multilayer PCB, the radiated interference field from a signal line to adjacent layer together with Faraday fence is calculated, and the relationship between the electromagnetic interference field and multiple parameters is researched.
基于多层PCB模型，研究了强信号线对仅存在桩栅栏的邻层的电磁辐射干扰场，分析了多种结构参数对电磁辐射干扰场的影响规律。 - Through hole filling is always a big challenge for wave soldering in multilayer PCB assembly, especially when encountering thick boards or components with large thermal dissipation.
钎料的通孔填充性问题一直是无铅波峰焊工艺在焊接双面板或多层板时一个很大的挑战，特别是遇到大厚板或者存在大吸热元件时填充不良现象尤为严峻。